US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Memory including zigzag bit lines and method for manufacturing same" (Chinese Inventor)

Posted On: 2026-07-28

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,444, issued on July 28, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Memory including zigzag bit lines and metho... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Integrated circuit with back-side metal line, method of fabricating the same, and layout method" (Taiwanese Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,445, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit with back-si... Read More

US Patent Issued to Micron Technology on July 28 for "Microelectronic devices with support pillars spaced along a slit region between pillar array blocks" (Idaho Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,446, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices with support pillars spaced along a... Read More

US Patent Issued to SK hynix on July 28 for "Semiconductor device and manufacturing method thereof" (South Korean Inventor)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,447, issued on July 28, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and manufacturing method thereof" was... Read More

US Patent Issued to Kioxia on July 28 for "Semiconductor device" (Japanese Inventor)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,448, issued on July 28, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device" was invented by Ken Komiya (Nagoya Aichi, Japan). Acc... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor devices and data storage systems including the same" (South Korean Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,449, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices and data storage syste... Read More

US Patent Issued to SK hynix on July 28 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,450, issued on July 28, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and method of manufacturing semicon... Read More

US Patent Issued to SK hynix on July 28 for "Three-dimensional semiconductor memory device with high aspect ratio" (South Korean Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,451, issued on July 28, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Three-dimensional semiconductor memory device with high as... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Vertical memory device and method of manufacturing the same" (South Korean Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,452, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Vertical memory device and method of manufac... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor memory device having horizontally spaced selection structures and electronic system including the same" (South Korean Inventors)

Posted On: 2026-07-28

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ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,453, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor memory device having horizonta... Read More

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US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 28 for "Memory including zigzag bit lines and method for manufacturing same" (Chinese Inventor)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Integrated circuit with back-side metal line, method of fabricating the same, and layout method" (Taiwanese Inventors)

US Patent Issued to Micron Technology on July 28 for "Microelectronic devices with support pillars spaced along a slit region between pillar array blocks" (Idaho Inventors)

US Patent Issued to SK hynix on July 28 for "Semiconductor device and manufacturing method thereof" (South Korean Inventor)

US Patent Issued to Kioxia on July 28 for "Semiconductor device" (Japanese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor devices and data storage systems including the same" (South Korean Inventors)

US Patent Issued to SK hynix on July 28 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventors)

US Patent Issued to SK hynix on July 28 for "Three-dimensional semiconductor memory device with high aspect ratio" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Vertical memory device and method of manufacturing the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor memory device having horizontally spaced selection structures and electronic system including the same" (South Korean Inventors)